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2024年12月28日发(作者：mooc中国大学)

专利内容由知识产权出版社提供

专利名称：LAMINATED LAYER CIRCUIT SUBSTRATE

发明人：MASAKI KENICHI,MORI FUJIO

申请号：JP3596488

申请日：19880218

公开号：JPH01209795A

公开日：19890823

摘要：PURPOSE:To effectively insulate between circuit substrates by connecting an

electric connection part between the substrates through a conductive material having

adhesive properties in a laminated circuit substrate in which two circuit substrates are

laminated in such a manner the circuit forming faces of the substrates face to each other,

and adhering the nonelectric connection parts through a both-side adhesive sheet.

CONSTITUTION:As a conductive material 4 having adhesive properties for connecting

electric connection parts between two circuit substrates, a hot metal type conductive

paste or conductive sheet is employed. When volatile part can be easily volatilized,

deposition dry type conductive paste is employed, and when the substrates can

sufficiently transmit an ultraviolet ray and a paste film is thick, ultraviolet ray curable type

conductive paste is employed. A both-side adhesive sheet 3 for adhering by insulating the

two substrates is provided with adhesive layers 32 on both side faces of a base material

31 made of plastic film, paper, cloth, etc. Mold release paper is provided on the layer 32

as required. The mold release paper is isolated and adhered to the circuit forming face of

the substrate at the time of using. The shape of the sheet 3 is suitably designed in

response to the type of the conductive material 4 to be used for the electric connection

part.

申请人：NISSHA PRINTING CO LTD

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