admin 管理员组

文章数量: 1087135


2024年12月29日发(作者：php隐藏后缀)

专利内容由知识产权出版社提供

专利名称：METHOD AND DEVICE FOR PREVENTING

UPWARD WARPAGE OF SUBSTRATE

发明人：YOKOTA SENICHI

申请号：JP13819988

申请日：19880605

公开号：JPH01307292A

公开日：19891212

摘要：PURPOSE:To prevent the upward warpage of a substrate easily without bringing

any mechanical member into contact therewith by spraying air against the top face of the

substrate from the upper section of the substrate, on which an electronic part of loaded

and the electronic part is conveyed by a conveyor, and downward pushing the substrate.

CONSTITUTION:When a substrate 2 is conveyed by a conveyor and reaches the position

of a lead cutter 5, an air valve is opened, and compressed air is decompressed properly,

introduced into a communicating hole 11b from an air port 11c, and injected at

appropriate speed from a jet 11a. Air is sprayed against the top face 2C of the substrate,

downward pressure is worked to the substrate 2, and the substrate 2 is pushed

downward against the upward warpage of the substrate 2 even when the substrate 2 is

intended to be warped upward. The downward warpage of the substrate 2 of prevented

by roller pins 6 holding the underside 2b of the substrate 2 at a horizontal position.

Accordingly, the upward warpage of the substrate can be prevented easily while the

possibility of the damage of the fillet of solder formed to electronic part itself and a lead

can be removed.

申请人：YOKOTA KIKAI KK

更多信息请下载全文后查看


本文标签： 专利 全文 下载 知识产权 出版社

版权声明：本文标题：METHOD AND DEVICE FOR PREVENTING UPWARD WARPAGE OF 内容由网友自发贡献，该文观点仅代表作者本人， 转载请联系作者并注明出处：http://roclinux.cn/p/1735501646a1673138.html， 本站仅提供信息存储空间服务，不拥有所有权，不承担相关法律责任。如发现本站有涉嫌抄袭侵权/违法违规的内容，一经查实，本站将立刻删除。