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2024年12月28日发(作者：滑块导轨一般在哪买)

专利内容由知识产权出版社提供

专利名称：Production manner of reversal die IC,

reversal die IC and IC module

发明人：MICHII KAZUNARI,道井 一成,SEKI HIROSHI,関

博司

申请号：JP特願平3-266412

申请日：19911015

公开号：JP第2634516号B2

公开日：19970730

摘要：A method of manufacturing inversion type ICs includes connecting a first

electrode pad group 22a of a semiconductor chip 21 to an opposite lead group 34b via

wires 33; connecting a second electrode pad group 22b to a further lead group 34a via

wires; sealing the semiconductor chip, the first and second lead groups and the wires by a

resin so that the outer lead portions of the leads are exposed; and bending the outer

lead portions of the leads towards the bottom surface of the semiconductor chip. An IC

module includes: a mounting substrate 28; a standard type IC 20; an inversion type IC 30

which is mounted on the bottom surface of the mounting substrate so that the leads

having the same function as those of the standard type IC come to the same point with

the mounting substrate in between, first and second electrode pad groups 22a, 22b

formed on the surface of the semiconductor chip being connected via wires to second

and first lead groups 34b, 34a, respectively, and the outer lead portions of the leads

being bent towards the bottom surface of the semiconductor chip; and a plurality of

connecting members, provided on the mounting substrate, for electrically connecting the

leads of the standard type IC and the leads of the inversion type IC having the same

function as those of the standard type IC.

申请人：MITSUBISHI DENKI KK,三菱電機株式会社

地址：東京都千代田区丸の内二丁目2番3号

国籍：JP

代理人：曾我 道照 (外6名)

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