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2024年12月29日发(作者：topic与queue)

专利内容由知识产权出版社提供

专利名称：MULTICHIP MODULE AND MODULE

SUBSTRATE THEREFOR

发明人：MATSUMOTO KUNIO,NORO

TAKANOBU,ISADA NAOYA

申请号：JP28739187

申请日：19871116

公开号：JPH01129449A

公开日：19890522

摘要：PURPOSE:To improve a module function such as the increase of computing

speed, to eliminate the need for a special cooling system at the time of inspection and to

simplify an inspection process by forming a pad for changing inspection-technique onto

the rear of a substrate and a power bus onto the surface of the substrate.

CONSTITUTION:Since pads 50 for changing inspection-technique are arranged onto the

rear of a substrate, chips 10 can be disposed in density higher than the pads have been

arranged around the chips 10 by 40-50%. On inspection, a probe for inspection can be

connected from the rear direction or the substrate, and a module can be inspected under

the state of the assembled module. Consequently, a special cooling system need not be

prepared on inspection. The probe for inspection is positioned easily to the pads 50 for

changing inspection- technique disposed on a plane. The easy positioning of the probe

for inspection also results in the connection of a technique varying wiring 60. For arrange

the pads 50 for changing inspection-technique onto the rear of the substrate,

input/output pins 35 are placed around a module substrate 30 and a power system onto

the surface of the substrate as power buses 40.

申请人：HITACHI LTD

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