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2024年12月28日发(作者:onclick事件无法触发)

专利内容由知识产权出版社提供

专利名称:SUBSTRATE HOLDER, SUBSTRATE HOLDER

UNIT, SUBSTRATE TRANSFER APPARATUS

AND SUBSTRATE BONDING APPARATUS

发明人:MAEDA, Hidehiro,YOSHIHASHI, Masahiro

申请号:JP2009001134

申请日:20090313

公开号:WO09/113317P1

公开日:20090917

摘要:A substrate holder is correctly transferred in a state where a substrate is held

by the substrate holder. The substrate holder holds the substrate by an electrostatic

force generated by power supply from the external, and the substrate holder is

transferred in the state where the substrate is held. The substrate holder is provided

with a holder main body whereupon the substrate is placed, and a connecting terminal

which is exposed from the holder main body and can be attached to and removed from

an external power supply terminal. A substrate transfer apparatus is provided for

transferring the substrate holder which is holding the substrate by the electrostatic

force generated by power supply from the external. The substrate transfer apparatus is

provided with a placing section, which has a placing surface for placing the substrate

holder and holds the substrate holder, and the power supply terminal for supplying

power to the substrate holder placed on the placing surface.

申请人:MAEDA, Hidehiro,YOSHIHASHI, Masahiro

地址:JP,JP,JP

国籍:JP,JP,JP

代理机构:RYUKA, Akihiro

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