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2024年12月28日发(作者:onclick事件无法触发)
专利内容由知识产权出版社提供
专利名称:SUBSTRATE HOLDER, SUBSTRATE HOLDER
UNIT, SUBSTRATE TRANSFER APPARATUS
AND SUBSTRATE BONDING APPARATUS
发明人:MAEDA, Hidehiro,YOSHIHASHI, Masahiro
申请号:JP2009001134
申请日:20090313
公开号:WO09/113317P1
公开日:20090917
摘要:A substrate holder is correctly transferred in a state where a substrate is held
by the substrate holder. The substrate holder holds the substrate by an electrostatic
force generated by power supply from the external, and the substrate holder is
transferred in the state where the substrate is held. The substrate holder is provided
with a holder main body whereupon the substrate is placed, and a connecting terminal
which is exposed from the holder main body and can be attached to and removed from
an external power supply terminal. A substrate transfer apparatus is provided for
transferring the substrate holder which is holding the substrate by the electrostatic
force generated by power supply from the external. The substrate transfer apparatus is
provided with a placing section, which has a placing surface for placing the substrate
holder and holds the substrate holder, and the power supply terminal for supplying
power to the substrate holder placed on the placing surface.
申请人:MAEDA, Hidehiro,YOSHIHASHI, Masahiro
地址:JP,JP,JP
国籍:JP,JP,JP
代理机构:RYUKA, Akihiro
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