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2024年12月28日发(作者：开发者工具怎么用)

专利内容由知识产权出版社提供

专利名称：Method of soldering a lead to a sintered

lead pad

发明人：Donald Neuhoff,Arthur H. Mones,Man K.

Lam

申请号：US06/137043

申请日：19800403

公开号：US04295271A

公开日：19811020

摘要：A solderable gold conductor composition is formed by dispersing gold and

certain inorganic binders in an inert liquid vehicle composition which can be used to

produce conductor patterns which patterns adhere to fired ceramic substrates and to

which can be soldered leads of electronic components.

A method of soldering a copper lead to a lead pad on a substrate. A conductor

pattern including at least one lead pad is printed on the substrate using a gold thick film

paste composition. The gold composition is composed of finely divided gold particles

and finely divided inorganic binder particles dispersed in an inert liquid vehicle, containing

by weight 98-99 percent gold particles and complementally 2-1 percent of inorganic

binder particles. The binder consists essentially by total weight of gold and binder of 0.6-

0.2 percent copper, 0.2 percent lead, 0.2 percent cadmium and the balance being glass.

The pattern is then fired to sinter the inorganic materials, and the fired pad is

presoldered without the necessity for physically or chemically precleaning the pad prior

to soldering. A presoldered copper lead of an electronic component, for example, is then

soldered to the presoldered pad.

申请人：HONEYWELL INFORMATION SYSTEMS INC.

代理人：E. W. Hughes,W. W. Holloway, Jr.,N. Prasinos

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