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2024年12月28日发(作者：300转二进制怎么算)

专利内容由知识产权出版社提供

专利名称：SUBSTRATE PROCESSING UNIT, SUBSTRATE

TRANSFER METHOD, SUBSTRATE

CLEANSING PROCESS UNIT, AND

SUBSTRATE PLATING APPARATUS

发明人：SEKIMOTO, Masahiko,YOKOYAMA,

Toshio,WATANABE, Teruyuki,SUZUKI,

Kenichi,KOBAYASHI, Kenichi,KATO, Ryo

申请号：EP06783145.3

申请日：20060825

公开号：EP1920458A1

公开日：20080514

摘要：To provide a substrate processing unit, a substrate transfer method, a

substrate cleansing process unit, and a substrate plating apparatus that make it possible

for a substrate carry-in mechanism such as a robot arm to quickly release hold on the

substrate after carrying in the substrate so as to shorten the time for holding the

substrate and improve throughput. The substrate processing unit (10) includes a

substrate holding mechanism (10) for holding the substrate (11) in a specified holding

position, and a processing mechanism (32) for applying a specified process to the

substrate held with the substrate holding mechanism in which a substrate guide

mechanism (20) is provided with a guide pin (15) for guiding the substrate to vicinity of a

holding position. The substrate holding mechanism has a plural number of rollers (14) on

an outer periphery of the holding position of the substrate, with the plural number of

rollers adapted to hold the substrate by supporting the periphery of the substrate from

sides thereof in the vicinity of the holding position, and the roller has an integral

structure made up of a large diameter portion and a small diameter portion formed

above the large diameter portion, with an upper portion of the large diameter portion

having a shoulder portion for the substrate in transfer to be temporarily placed on, and

with the shoulder portion formed with a sloped surface sloping down toward its

periphery.

申请人：EBARA CORPORATION

地址：11-1, Haneda Asahi-cho Ohta-ku, Tokyo 144-8510 JP

国籍：JP

代理机构：Wagner, Karl H.

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