admin 管理员组

文章数量: 1088098


2024年12月27日发(作者：百度云搜索引擎入口)

专利内容由知识产权出版社提供

专利名称：Underfill dispense at substrate aperture

发明人：Charles Anthony Odegard,Marvin Wayne

Cowens,Leon Stiborek

申请号：US11109259

申请日：20050419

公开号：US2A1

公开日：20061019

专利附图：

摘要：Disclosed are methods for dispensing underfill material in an IC assembly

having a die mounted on a substrate with a gap therebetween. One or more aperture is

provided in the substrate for receiving underfill material into the gap. Underfill material

is dispensed into the gap through the one or more apertures, thereby filling the gap with

underfill material and providing a favorable flow rate and improved underfilling.

Embodiments of the invention are disclosed in which capillary action, a vacuum, or positive

pressure, are used to assist in the flow of the underfill material.

申请人：Charles Anthony Odegard,Marvin Wayne Cowens,Leon Stiborek

地址：McKinney TX US,Plano TX US,Dallas TX US

国籍：US,US,US

更多信息请下载全文后查看


本文标签： 专利 知识产权 出版社 内容 百度

版权声明：本文标题：Underfill dispense at substrate aperture 内容由网友自发贡献，该文观点仅代表作者本人， 转载请联系作者并注明出处：http://roclinux.cn/p/1735321594a1647841.html， 本站仅提供信息存储空间服务，不拥有所有权，不承担相关法律责任。如发现本站有涉嫌抄袭侵权/违法违规的内容，一经查实，本站将立刻删除。