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2024年12月28日发(作者：w3c魔兽平台)

专利内容由知识产权出版社提供

专利名称：METHOD OF FORMING A COMPOSITE

SUBSTRATE FOR LAYERED HEATERS

发明人：Jacob R. Lindley,Dean J. Meyer,Alexander D.

Glew

申请号：US14875757

申请日：20151006

公开号：US2A1

公开日：20160204

专利附图：

摘要：A method of forming a heater assembly for use in semiconductor processing

includes thermally securing a heater substrate to an application substrate; and applying a

layered heater having at least one functional layer to the heater substrate after the

heater substrate is secured to the application substrate. The heater substrate defines a

material having a coefficient of thermal expansion that is matched to a coefficient of

thermal expansion of the functional layer. The material of the functional layer is not

capable of withstanding the elevated temperature of the thermal securing step.

申请人：Watlow Electric Manufacturing Company

地址：St. Louis MO US

国籍：US

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