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2024年12月28日发(作者：linux curl命令安装)

专利内容由知识产权出版社提供

专利名称：Substrate for circuit wiring

发明人：Hiromichi Watanabe,Yoshifumi

Fukatsu,Hideaki Kaino

申请号：US10723349

申请日：20031125

公开号：US07078628B2

公开日：20060718

专利附图：

摘要：The present invention concerns a substrate for circuit wiring in which an

electronic component is mounted, by soldering, to a wiring pattern formed on an

insulated layer deposited over a metallic substrate. A silica-based filler and a rubber-

based filler are added in the insulated layer to reduce the linear thermal expansion of the

layer and increase its elastic modulus. The mounting portion of an electronic component

is molded with a resin material to which a silica-based filler has been added, and which

thus has a coefficient of linear thermal expansion smaller than the coefficient of linear

thermal expansion of the insulated layer. This serves to alleviate the stress caused by the

linear thermal expansion of the metallic substrate, and thereby to prevent separation

from occurring between the insulated layer and the metallic substrate, as well as

between the insulated layer and the wiring pattern, when subjected to a high-

temperature environment.

申请人：Hiromichi Watanabe,Yoshifumi Fukatsu,Hideaki Kaino

地址：Kobe JP,Kobe JP,Kobe JP

国籍：JP,JP,JP

代理机构：Christie, Parker & Hale, LLP

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