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2024年12月28日发(作者：c tostring)

专利内容由知识产权出版社提供

专利名称：Substrate case and substrate installation

device

发明人：横井 日出夫

申请号：JP2008034596

申请日：20080215

公开号：JP4110206B1

公开日：20080702

摘要：

PROBLEM TO BE SOLVED: To provide a board attachment device capable of easily

sealing-closing a case without using another member such as a caulking pin, reducing the

number of components to be easily sealed-fixed to a case holder, and easily performing

a sealing work.

SOLUTION: The rear surface opening part of a case body 20A for holding a control

board is sealed with a cover 20B. A plurality of first lock pieces 24A projecting toward a

back surface side are horizontally arranged at the upper edge part of the case body 20A

on a front surface side. Fixing parts 23B, 33 to which the first lock pieces are inserted are

arranged in the respective upper edge parts of the cover 20B on the rear surface side

and the case holder 30. The respective first lock pieces 24A include: pawl fitting parts 26A

to which engagement pawls 25B, 35 inside the corresponding fixing parts are fitted; and

removable second lock pieces 27A to prevent the fitting. When the second lock pieces

27A are previously removed, the first lock pieces 24A are connected and fixed to the

fixing parts 23B, 33. In the case of re-fixing, the second lock pieces 27A are removed and

inserted to the corresponding fixing parts 23B, 33.

COPYRIGHT: (C)2009,JPO&INPIT

申请人：ネット株式会社

地址：大阪府大阪市中央区島之内一丁目２２番１７号

国籍：JP

代理人：柳舘 隆彦

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