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2024年12月27日发(作者：模块建房彩页)
pcb正片和负片工艺流程
英文回答：
PCB (Printed Circuit Board) manufacturing involves two
main processes: the positive photoresist process and the
negative photoresist process. Both processes are used to
create circuit patterns on the PCB.
Positive Photoresist Process:
1. Substrate Preparation: The PCB substrate, usually
made of fiberglass or composite materials, is cleaned and
prepared for the subsequent steps.
2. Photoresist Coating: A layer of positive photoresist
material is applied onto the substrate using a spin coating
technique.
3. Prebaking: The coated substrate is heated to remove
any solvent and to ensure the uniformity of the photoresist
layer.
4. Exposure: The PCB artwork, which contains the
desired circuit pattern, is aligned and placed on top of
the coated substrate. The assembly is then exposed to UV
light.
5. Development: The exposed substrate is immersed in a
developer solution, which selectively removes the unexposed
photoresist, leaving behind the desired circuit pattern.
6. Etching: The exposed copper areas on the substrate
are etched away using an etchant solution, leaving behind
the circuit traces.
7. Stripping: The remaining photoresist is removed from
the substrate using a stripping solution.
8. Inspection and Testing: The PCB is inspected for any
defects or errors in the circuit pattern. Electrical
testing may also be performed to ensure the functionality
of the circuit.
Negative Photoresist Process:
1. Substrate Preparation: Similar to the positive
photoresist process, the PCB substrate is cleaned and
prepared.
2. Photoresist Coating: In this process, a layer of
negative photoresist material is applied onto the substrate.
3. Prebaking: The coated substrate is heated to ensure
the uniformity of the photoresist layer.
4. Exposure: The PCB artwork, containing the inverse of
the desired circuit pattern, is aligned and placed on top
of the coated substrate. The assembly is then exposed to UV
light.
5. Development: The exposed substrate is immersed in a
developer solution, which selectively removes the exposed
photoresist, leaving behind the inverse of the desired
circuit pattern.
6. Etching: The unexposed copper areas on the substrate
are etched away, leaving behind the circuit traces.
7. Stripping: The remaining photoresist is removed from
the substrate.
8. Inspection and Testing: Similar to the positive
photoresist process, the PCB is inspected and tested for
any defects or errors.
中文回答：
PCB（Printed Circuit Board）制造涉及到两个主要工艺流程，
正片工艺流程和负片工艺流程。这两个工艺流程都用于在PCB上创
建电路图案。
正片工艺流程：
1. 基板准备，PCB基板通常由玻璃纤维或复合材料制成，需要
进行清洁和准备，以便进行后续步骤。
2. 光阻涂覆，使用旋涂技术在基板上涂覆一层正片光阻材料。
3. 预烘，加热涂覆的基板，以去除任何溶剂并确保光阻层的均
匀性。
4. 曝光，将包含所需电路图案的PCB艺术品与涂覆的基板对准
并放置在一起，然后经过紫外线照射。
5. 显影，将曝光的基板浸入显影液中，显影液会选择性地去除
未曝光的光阻，留下所需的电路图案。
6. 蚀刻，使用蚀刻液去除基板上的暴露铜区域，留下电路线路。
7. 去除光阻，使用去除液去除基板上剩余的光阻。
8. 检验和测试，检查PCB是否存在任何缺陷或电路图案中的错
误。还可以进行电气测试以确保电路的功能性。
负片工艺流程：
1. 基板准备，与正片工艺流程类似，清洁和准备PCB基板。
2. 光阻涂覆，在这个工艺流程中，涂覆一层负片光阻材料在基
板上。
3. 预烘，加热涂覆的基板，以确保光阻层的均匀性。
4. 曝光，将包含所需电路图案的PCB艺术品的反向与涂覆的基
板对准并放置在一起，然后经过紫外线照射。
5. 显影，将曝光的基板浸入显影液中，显影液会选择性地去除
曝光的光阻，留下电路图案的反向。
6. 蚀刻，去除基板上未曝光的铜区域，留下电路线路的反向。
7. 去除光阻，从基板上去除剩余的光阻。
8. 检验和测试，与正片工艺流程类似，检查和测试PCB是否存
在任何缺陷或电路图案中的错误。
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