IT-180A Process Guideline rev 06-11 联茂 板材 报告

IT-180ABS/IT-180ATC

High Tg, Low CTE, Multifunctional Filled Epoxy Resin and Phenolic-Cured Laminate & Prepreg

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Process Guideline

These process guidelines are the ITEQ interior test experience. We believed that should have helps for the PCB manufacturer.

Especially, for those print circuit board manufacturers who first time apply this material. But these experiences will be unable to cover

all rank of designs and applications, as well as print circuit board fabrication equipments, chemicals and technologies. The suggestions

must pass through initial trial run to set up the process, and then the basis actual test results carried on the working condition and the

revision.

1. Material Handling & Storage

(1) Shelf life is at least three months when prepreg stored in a cool dry environment (Temperature

less than 20℃and Humidity less than 50%RH). Six months shelf life under 5℃.

(2) Prepreg should exposed to well humidity and temperature controlled environment.

(3) Prepreg should be stored in controlled environment for 12 hours before to use.

(4) Prepreg supplied in rolls or panels should be stored horizontally. To avoid damage, no stacking is

recommended.

(5) Laminates should be stored in a dry environment.

(6) Laminate should always be stored flat.

2. Inner Layer & Copper Treatment

(1) Scaling factors may performer differently by laminate thickness, as well as the ration of remnant

copper. First article must be run before mass production to determine suitable compensation

factor.

(2) The inner layers should be put in a temperature and humidity controlled room for 8 hours before

punching guide hole and AOI. That attribute to better dimension stability and registration

purpose.

(3) Inner layers should be baked for 40 minutes at 120℃at least after black or brown oxides

treatment.

(4) We strongly suggest to re-new fresh rinse water of DES lines and brown/black oxide lines, that

would help to against CAF(Conductive Anode Filament) problem. An abundant of metallic ions

and other pollution remain in the tanks, that maybe cause CAF failure.

IT-180A Process Guideline REV 06-11

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3. Lamination Overview

(1) Stacks must be prepared in a temperature and humidity controlled lay-up room to avoid moisture

absorption.

(2) It is recommended to apply vacuum for 10-30 minutes before temperature ramping up. Vacuum

hydraulic machine is recommended for lamination process. The heating raise by thermal couple

is 1.5~2.0℃/min from 80℃ to 140℃ and keep the temperature at 185℃ above for more than 60

minutes is necessary. Full pressure is 300-400 psi. Cooling rate below 3℃/min is recommended

as shown in Figure 1.

Figure 1. Recommended press cycle

(3) For those PCB manufacturers who use hot start (more than 180℃), lowering 25-50 psi is proper.

However, for some of PCB manufactures may be proper to get pressure drop for 100 psi that is

also workable. Provide full pressure at 90-120℃ by product temperature (not platen temperature)

is recommended.

(4) The resin flow properties of this material would help to filled resin for heavy copper application,

thus we suggest setup even higher level than above recommended press cycle, and please

making cross section to check if the glass fiber sticks on the inner layer copper, especially for

more than 2oz inner layer. 5um butter core at least or more is recommended and it will enhance

thermal reliability.

(5) For the construction of multi-plies ultra heavy glass (7628) and with ultra high resin content, we

estimate that have more resin flow of the board edge, but doesn’t influence the reliability,

however, we suggest to use bigger copper foil or to move the full pressure down, that could be

avoid resin to stick steel platen.

(6) The dynamic viscosity at 1.5-3℃/min (Figure 2.) are shown as below for user’s reference.

IT-180A Process Guideline REV 06-11

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(7) Each single press will possibly have different temperature rise curve. Therefore, to trace heat rise

and Tg in middle and outer laminates with thermal couple as well as cross section which can

confirm the results are reliable.

Figure 2. Dynamic viscosity at 1.5-3℃/min

4. Drill Process

(1) We suggest to use undercut drill bit for the hole size less than 1.2mm hole size. The hit counts

for hole size less than 0.5mm (20mil) would be around 500-1000 hits. Hole size larger than

0.5mm can be up to 800-1500 hits.

(2) Standard Aluminum entry board and backup board work well.

(3) Heavy copper (inner layer copper thickness > =3oz), higher layer boards, thick boards or

multi-plies ultra heavy glass fiber (7628), we suggest to use lubricate Aluminum entry board

would help for reduce heat in the hole. The parameters that are with lower speed and lower

infeed and retract would be helpful for hole wall quality.

(4) Please make sure the dirt and dust are drawn into a vacuum suction. It would be helpful to

against gouging in the holes.

(5) Baking at 120~140°C for 2 hours after drilling process to soften the smear maybe helpful for

smear removal. (Some one bake the boards before plasma or desmear that looks good for

higher layer and thick boards)

(6) Stack height is according to the board construction and overall thickness and aspect ratio.

(7) Below table lists the series parameters are just for user’s reference, we assume the board

thickness is around 0.080 inch. It needs to be fine tune for different tools, board constructions,

board thickness, layers and copper weights.

(8) After drilling process, using air guns blow the boards to avoid hole plug.

(9) According to internal tests, if occurs the perpendicular resin crack happened after thermal stress,

use higher chiploads for this material maybe can improve resin crack issue.

(10) For higher layers, thick or heavy copper boards, peak drilling (two to three steps) maybe

necessary to drive to high quality drilling performance, including roughness, nail head, smear,

even attribute to IP/ICD problem.

IT-180A Process Guideline REV 06-11

PDF created with pdfFactory Pro trial version