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2024年12月28日发(作者：accesssql查询语句)

专利内容由知识产权出版社提供

专利名称：LAMINATED CIRCUIT SUBSTRATE

发明人：Kuniaki YOSUI,Masahiro OZAWA

申请号：US14748623

申请日：20150624

公开号：US2A1

公开日：20151015

专利附图：

摘要：Sheets are laminated on each other and pressure bonded with fixtures from

upper and lower directions of a lamination direction while being heated to produce a

laminated circuit substrate including therein a capacitor and a coil. The capacitor is

defined by a first conductor pattern and a second conductor pattern that face each other

across thermoplastic resin layers. In the laminated circuit substrate, the first conductor

pattern includes a first principal surface, the second conductor pattern includes a second

principal surface, the first principal surface faces the second conductor pattern, the

second principal surface faces the first conductor pattern, and the first principal surface

and the second principal surface are subject to a roughening process.

申请人：Murata Manufacturing Co., Ltd.

地址：Nagaokakyo-shi JP

国籍：JP

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