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2024年12月28日发(作者：oops用中文谐音读出来)

专利内容由知识产权出版社提供

专利名称：Substrate-based IC package

发明人：Martin Reiss,Steffen Kroehnert

申请号：US10868516

申请日：20040615

公开号：US07030473B2

公开日：20060418

专利附图：

摘要：The invention relates to a substrate-based IC package that includes a substrate

on which a chip is mounted with a die attach material. The substrate is provided with a

solder resist and has, on the side opposite the chip, conductor tracks provided with

soldering globules. The conductor tracks are electrically coupled to the chip via wire

jumpers, which extend through a bond channel which is filled with a mold compound. The

chip and the substrate are encapsulated with a mold cap on the chip side. The substrate

is provided with spacers for supporting a printing template for applying the die attach

material. A strip of a solder resist that surrounds at least the bond channel gaplessly

with essentially the same width is provided as the spacer.

申请人：Martin Reiss,Steffen Kroehnert

地址：Ottendorf-Okrilla OT Medingen DE,Dresden DE

国籍：DE,DE

代理机构：Slater & Matsil, L.L.P.

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