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2024年12月29日发(作者：android apk签名原理)

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专利名称：Substrate pinching apparatus, film forming

apparatus, and film forming method

发明人：大谷 啓介

申请号：JP2016131734

申请日：20160701

公开号：JP6309047B2

公开日：20180411

摘要：Provided is a substrate pinching device capable of switching from a pinching

state to a release state without attaching a substrate to a pressing member. The

substrate pinching device comprises: a support member (2) supporting a substrate (1); a

pressing member (3) facing the support member (2) and pressing the substrate (1); and at

least three pressing members (4), the pressing members protruding toward the

substrate (1), formed on a surface facing the substrate (1) of the pressing member (3).

The substrate pinching device pinches the substrate (1) using the support member (2)

and the pressing member (3). The pressing members (4) are installed so that peak parts

(4a) of other two pressing members are separated from a peak part (4a) of the pressing

member (4) from a planar direction, which is parallel to the facing surface, to other

directions. The pressing members (4) press the substrate (1).

申请人：キヤノントッキ株式会社

地址：新潟県見附市新幸町１０番１号

国籍：JP

代理人：吉井 剛,吉井 雅栄

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