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2024年12月28日发(作者：linebreak是什么意思)

专利内容由知识产权出版社提供

专利名称：Handotaisochi

发明人：TAKEDA YUKIO,NAKAMURA

KOSUKE,MATSUSHITA YASUO,OOGOSHI

TOKIO

申请号：JP1964182

申请日：19820212

公开号：JPH0247856B2

公开日：19901023

摘要：PURPOSE:To improve thermal stability by mounting circuit elements on a

substrate made of sintered insulation material which has the expansion coefficient similar

to silicon and the specified thermal conductivity at room temperature.

CONSTITUTION:Circuit elements are mounted on a substrate made of electrical

insulation material which has the thermal expansion coefficient similar to silicon and the

thermal conductivity not less than 0.25Cal/. deg.C. In such case, beryllium oxide

powder is added to silicon carbide powder and mixed, and the mixture is formed by

compression. The formed body is then sintered in a graphite die. The sintered body of

high density, high thermal conductivity, high electrical resistance and low thermal

expansion coefficient can be obtained when the content of beryllium to the silicon

carbide powder is 0.1-3.5wt%, AnSi-element 11 is directly soldered to the substrate 15

made of the sintered silicon carbide which contains 0.5wt% of beryllium to compose a

semiconductor powder module, so that an electric device of very simply composition can

be obtained.

申请人：HITACHI LTD

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