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2024年12月27日发(作者：安卓app开发外包)

专利内容由知识产权出版社提供

专利名称：Substrate with a flattening film, display

substrate, and method of manufacturing the

substrates

发明人：Tohru Ueda

申请号：US10370461

申请日：20030224

公开号：US2A1

公开日：20031002

专利附图：

摘要：The invention involves: the forming of a dummy pattern for planarization

between convex portions (for example, between lead electrodes and a signal wire

pattern) of irregularities caused by a patterned layer on a surface on which at least one

interlayer insulating film is formed, so as to be separated by a predetermined distance

from the convex portions; the forming of interlayer insulating films -so as to fill up gaps

between the dummy pattern and the convex portions; and the planarizing of a surface.

Thereby, the invention is capable of relaxing requirements on uniformity in the thickness

of the film to be polished and the thickness of the polished portion.

申请人：UEDA TOHRU

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