安森美半导体 MBR1635 D 开关电源整流器 45V 16A 说明书

MBR1635, MBR1645,MBRB1645, NRVBB1645Switch-modePower Rectifiers16 A, 35 and 45 VFeaturesThese state−of−the−art devices use the Schottky Barrier principle

with a platinum barrier ://KINGDIAGRAMSTO−220ACCASE 221BPLASTIC•••••Guard−ring for Stress ProtectionLow Forward Voltage175°C Operating Junction TemperatureNRVB Prefix for Automotive and Other Applications RequiringUnique Site and Control Change Requirements; AEC−Q101Qualified and PPAP CapableThese Devices are Pb−Free and are RoHS Compliant4AYWWGB16x5KAMechanical Characteristics:1331, 4•Case: Epoxy, Molded•Weight:1.9 Grams for TO−2201.7 Grams for D2PAK•Finish: All External Surfaces Corrosion Resistant and Terminal•Leads are Readily SolderableLead Temperature for Soldering Purposes:260°C Max. for 10 SecondsRatingPeak Repetitive Reverse VoltageWorking Peak Reverse VoltageDC Blocking VoltageMBR1635MBR1645MBRB1645Average Rectified Forward Current Delay(Rated VR, TC = 163°C) Total DevicePeak Repetitive Forward Current, PerLeg(Rated VR, Square Wave,20 kHz, TC = 157°C) Total DeviceNon−Repetitive Peak Surge Current(Surge Applied at Rated Load ConditionsHalfwave, Single Phase, 60 Hz)Peak Repetitive Reverse Surge Current(2.0 ms, 1.0 kHz)Storage Temperature RangeOperating Junction Temperature (Note 1)Voltage Rate of Change (Rated VR)AYWWB16x5xKAG= Assembly Location= Year= Work Week= Device Code= 3 or 4= Diode Polarity= Pb−Free PackageMAXIMUM RATINGSSymbolVRRMVRWMVRValueUnitV354545A16IFRM32A13143B1645AYWWG= Device Code= Assembly Location= Year= Work Week= Pb−Free Package4D2PAKCASE 418BSTYLE 3B1645GAYWWIF(AV)IFSM150AORDERING INFORMATIONDevicePackageTO−220(Pb−Free)TO−220(Pb−Free)D2PAK(Pb−Free)D2PAK(Pb−Free)Shipping50 Units / RailIRRMTstgTJdv/dt1.0−65 to +175−65 to +17510,000A°C°CV/msMBR1635GMBR1645GMBRB1645T4GNRVBB1645T4G50 Units / Rail800 Units / Rail800 Units / RailStresses exceeding Maximum Ratings may damage the device. MaximumRatings are stress ratings only. Functional operation above the RecommendedOperating Conditions is not implied. Extended exposure to stresses above theRecommended Operating Conditions may affect device heat generated must be less than the thermal conductivity fromJunction−to−Ambient: dPD/dTJ < 1/RqJA.© Semiconductor Components Industries, LLC, 20141April, 2014 − Rev. 12Publication Order Number:MBR1635/D

MBR1635, MBR1645, MBRB1645, NRVBB1645THERMAL CHARACTERISTICSCharacteristicMaximum Thermal Resistance, Junction−to−CaseSymbolRqJCValue1.5Unit°C/WELECTRICAL CHARACTERISTICSCharacteristicMaximum Instantaneous Forward Voltage (Note 2)(iF = 16 Amps, TC = 125°C)(iF = 16 Amps, TC = 25°C)Maximum Instantaneous Reverse Current (Note 2)(Rated dc Voltage, TC = 125°C)(Rated dc Voltage, TC = 25°C) Test: Pulse Width = 300 ms, Duty Cycle ≤2.0%.SymbolvF0.570.63iR400.2mAValueUnitV2

MBR1635, MBR1645, MBRB1645, NRVBB1645iF,

INSTANTANEOUS

FORWARD

CURRENT

(A)17.05.03.02.01.000.20.40.60.81.0vF, INSTANTANEOUS FORWARD VOLTAGE (V)TJ = 125°C100°C25°C1.0E−01TJ = 150°CIR,

REVERSE

CURRENT

(A)1.0E−02125°C1.0E−031.0E−041.0E−0525°C1.0E−061.0E−0VR, REVERSE VOLTAGE (V)Figure 1. Typical Forward VoltageFigure 2. Typical Reverse Current28dc26242220SQUARE18IF(AV),

AVERAGE

FORWARD

CURRENT

(A)700SQUAREWAVEdcdcIF(AV),

AVERAGE

FORWARD

CURRENT

(A)RqJA = 16°C/WRqJA = 60°C/W(No Heat Sink)125150175TC, CASE TEMPERATURE (°C)TA, AMBIENT TEMPERATURE (°C)Figure 3. Current Derating, Case, Per LegPF(AVE,)

AVERAGE

POWER

DISSIPATION

(W)Figure 4. Current Derating, Ambient161412(RESISTIVELOAD)PK+pIAVISQUARE WAVEIPK+5.0(CAPACITATIVE LOAD)10IAVdc8.0106.0204.02.0002.04.06.08.0IF(AV), AVERAGE FORWARD CURRENT (A)TJ = 125°CFigure 5. Forward Power Dissipation3

MECHANICAL CASE OUTLINEPACKAGE DIMENSIONSTO−220, 2−LEADCASE 221B−04ISSUE FDATE 12 APR 2013NOTES:IONING AND TOLERANCING PER ANSIY14.5M, LLING DIMENSION: DFGHJKLQRSTUINCHESMINMAX0.5950.6200.3800.4050.1600.1900.0250.0390.1420.1610.1900.2100.1100.1300.0140.0250.5000.5620.0450.0600.1000.1200.0800.1100.0450.0550.2350.2550.0000.050MILLIMETERSMINMAX15.1115.759.6510.294.064.820.641.003.614.094.835.332.793.300.360.6412.7014.271.141.522.543.042.042.791.141.395.976.480.0001.27CQSCALE 1:1BFTS4A13UHKLGDJRSTYLE 1:PIN 1. 2. 3. EN/AANODECATHODESTYLE 2:PIN 1. 2. 3. /ACATHODEANODEDOCUMENT NUMBER:DESCRIPTION:98ASB42149BTO−220, 2−LEADElectronic versions are uncontrolled except when accessed directly from the Document d versions are uncontrolled except when stamped “CONTROLLED COPY” in 1 OF 1ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specificallydisclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor therights of others.© Semiconductor Components Industries, LLC,

MECHANICAL CASE OUTLINEPACKAGE DIMENSIONSD2PAK 3CASE 418B−04ISSUE LDATE 17 FEB 2015NOTES:IONING AND TOLERANCINGPER ANSI Y14.5M, LLING DIMENSION: INCH.3.418B−01 THRU 418B−03 OBSOLETE,NEW STANDARD 418B−DEFGHJKLMNPRSVINCHESMINMAX0.3400.3800.3800.4050.1600.1900.0200.0350.0450.0550.3100.3500.100 BSC0.0800.1100.0180.0250.0900.1100.0520.0720.2800.3200.197 REF0.079 REF0.039 REF0.5750.6250.0450.055MILLIMETERSMINMAX8.649.659.6510.294.064.830.510.891.141.407.878.892.54 BSC2.032.790.460.642.292.791.321.837.118.135.00 REF2.00 REF0.99 REF14.6015.881.141.40SCALE 1:1CE−B−4VW123SA−T−SEATINGPLANEKGD3 PLMJHTBMW0.13 (0.005)VARIABLECONFIGURATIONZONELMRNULPLMMFVIEW W−W1FVIEW W−W2FVIEW W−W3STYLE 1:PIN TORSTYLE 2:PIN TYLE 3:PIN ESTYLE 4:PIN TORSTYLE 5:STYLE 6:PIN EPIN EMARKING INFORMATION AND FOOTPRINT ON PAGE 2DOCUMENT NUMBER:DESCRIPTION:98ASB42761B D2PAK 3Electronic versions are uncontrolled except when accessed directly from the Document d versions are uncontrolled except when stamped “CONTROLLED COPY” in 1 OF 2ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specificallydisclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor therights of others.© Semiconductor Components Industries, LLC,

D2PAK 3CASE 418B−04ISSUE LGENERICMARKING DIAGRAM*xxxxxxxxxxxAWLYWWGAYWWxxxxxxxxG AKADATE 17 FEB 2015xxxxxxxxGAYWWICxxAWLYWWGAKAStandardRectifier= Specific Device Code= Assembly Location= Wafer Lot= Year= Work Week= Pb−Free Package= Polarity Indicator*This information is generic. Please refer todevice data sheet for actual part −Free indicator, “G” or microdot “ G”,may or may not be ING FOOTPRINT*10.498.3816.1553.5041.0165.080PITCHDIMENSIONS: MILLIMETERS2X2X*For additional information on our Pb−Free strategy and solderingdetails, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, SOLDERRM/NT NUMBER:DESCRIPTION:98ASB42761B D2PAK 3Electronic versions are uncontrolled except when accessed directly from the Document d versions are uncontrolled except when stamped “CONTROLLED COPY” in 2 OF 2ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specificallydisclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor therights of others.© Semiconductor Components Industries, LLC,

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