覆铜板的分类(Classificationofcoppercladlaminate)

覆铜板的分类（Classification of copper clad laminate）

Classification and variety of copper clad laminate for PCB

substrate material

According to the different requirements and grades of PCB, the

main substrate material - CCL has many product varieties. They

are classified according to different rules.

(1) according to the mechanical rigidity of copper clad

laminate, the rigid copper clad laminate and flexible copper

clad laminate can be divided according to the mechanical

rigidity of copper clad laminate. Usually rigid copper clad

laminates are intermittently laminated. Flexible copper clad

laminates are heavily used to form copper foil on polyimide or

polyester films. The finished product is soft and has excellent

folding resistance. In recent years, with the load type

semiconductor package (TBA) and other development, with its

need for organic resin ribbon packaging substrate, also

appeared in the glass fiber cloth, epoxy resin and liquid

crystal polymer film and other thin copper clad zone shape

products.

(2) according to the different insulation material, the

structure is divided

According to different insulation materials and structures,

they can be divided into organic resin CCL, metal base (core)

copper clad plate and ceramic base copper clad laminate. The

structure and material composition of these three types of

copper clad laminate are shown in figure 2-1.

Metal clad copper clad plate is usually composed of three parts:

metal substrate, insulating medium and conductive layer

(usually copper foil). One or both surfaces of a metal substrate

to be chemically or electrochemically treated are coated with

an insulating dielectric layer and a copper foil, which is

compounded by hot pressing. According to the structure,

composition and properties of metal clad copper clad laminate,

there are many kinds of copper clad laminates. The structure

is divided into metal substrate, clad metal substrate and metal

core substrate. From the composition of the metal substrate is

divided into aluminum based copper clad laminate, iron based

copper clad laminate, copper based copper clad laminate,

molybdenum based copper clad laminate and so on. Divided from

the performance for a metal base copper clad laminate; flame

retardant metal base copper clad laminate; high heat-resistant

metal base copper clad laminate; high thermal conductivity type

metal base copper clad laminate; superconducting heat type

metal base copper clad laminate; high frequency type metal base

copper clad laminate; multilayer metal base copper clad

laminate. Metal clad copper clad laminate has excellent heat

dissipation, good mechanical properties, excellent

dimensional stability, electromagnetic shielding,

electromagnetic property, etc..

Ceramic based copper clad laminate (DBC) consists of ceramic

substrate, bonding bond layer and conductive layer (copper

foil). There are many kinds of ceramics, which can be classified

according to the types of materials used. If there are Al2O3,

SiO, MgO, Al2O3, SiC, AIN, ZnO, BeO, MgO, Cr2O3 and other kinds

of ceramic films. At present, the most widely used and is

"ceramic. It can also be divided into two categories: direct

key method and bonding lamination key.

(3) according to the thickness of different insulation layer

According to the thickness of CCL, it can be divided into

regular plate and thin plate. Generally, the thickness of

copper (not including copper foil) is less than 0.8mm of epoxy

resin clad laminate, called sheet (IPC standard is 0.5mm).

Epoxy glass cloth CCL thickness below 0.8mm thin board is

suitable for punching processing, and it can also be used as

the core material required in the fabrication of multilayer

board.

(4) divided by different reinforcement

In this division, when the copper plate uses some reinforcing

material, the copper clad sheet is called a material substrate.

Different from the commonly used reinforced rigid organic resin

laminate has three types of woven glass laminate; paper base

copper clad laminate; composite base copper clad laminate. In

addition, there are special reinforcing material composed of

copper plate, as well as: aramid fiber non-woven fabrics,

copper clad laminates, synthetic fiber based copper clad

laminate.

For fiber reinforced materials, there are differences between

organic fiber reinforced materials and inorganic reinforcing

materials. In recent years, the development of CO2 laser

manufacturing in hole processing PCB, using organic fiber

reinforced materials (such as: aramid fiber reinforced

material), due to the laser light absorption ability, and is

conducive to the laser hole machining. Most of the

reinforcement materials used for CCL are still inorganic

reinforcing materials. The common inorganic materials with

enhanced electronic grade (also called E) (referred to as glass

fiber cloth, glass fiber cloth) electronic grade glass fiber

paper (E) (hereinafter referred to as the glass paper, also

known as glass fiber non-woven, glass mat, glass paper).

The so-called composite copper clad laminate, mainly refers to

the insulating substrate, is the surface layer and core layer

using two different reinforcing materials composed of copper

clad laminate. In the composite base copper clad laminate, the

most common is CEM-1 (flame retardant copper clad modified

epoxy glass fiber cloth, paper core composite material laminate

(CEM-3) and flame retardant copper clad epoxy glass fiber cloth,

glass fiber paper core composite laminate substrate) two types.

(5) according to the insulation resin

The resin of the copper clad plate is made of some kind of resin,

and the copper clad plate is called a copper clad plate of a

resin type. At present, the most common are the main resin:

phenolic resin, epoxy resin (EP), polyimide (PI) resin,

polyester resin (PET) and polyphenylene ether resin (PPO) and

cyanate ester resin (CE), PTFE resin (PTFE), bismaleimide resin

(BT) was three.

Based on the above two principles of using different

reinforcing materials and different insulating resins, the

rigid CCL can be divided into five categories. These five

categories are: paper base copper clad laminate; CCLS based

composite; base copper clad laminate; lamination plywood

substrate materials; special base copper clad laminate. The

classification of these five types of substrate materials and

their respective specific main

Figure 2-2 a variety of substrate materials classified by

different reinforcing materials and different insulating

resins is shown in figure 2-2.

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You can delete the "worm" Mobo manual (6) according to the

classification of flame retardant properties

UL standard (UL94, UL746E, etc.) can be divided into different

flame retardant grades for the flame retardant properties of

substrate materials. That is, UL standards will be divided into

four kinds of substrate materials, different flame retardant

grades are: UL-94VO class; UL-94V1 class; UL-94V2 class and

UL-HB class. Generally speaking, according to the UL Standard

Test methods, testing, to achieve flame retardant UL-HB grade

CCL, known as non flame retardant copper clad laminate

(commonly known as HB board). To meet the flammability

requirements of the vertical combustion method in the UL

standard (the best flame retardant grade is grade UL-94VO), and

to call it a flame retardant copper clad laminate (commonly

known as VO board). This kind of "HB board" and "VO board"

popular term, in our country on paper based copper clad laminate

flame retardant classification of the appellation is still very

popular.

(7) according to a special performance of CCl

According to the special performance of CCL, the copper clad

boards of different grades are divided, which are mainly

displayed on some high-grade plates. Here are only a few

varieties of this classification.

1., according to the different classification of Tg

The glass transition temperature (Tg) is a description of the

organic insulating resin reaching a certain temperature point,

and the molecular morphology changes from glassy to rubbery.

The temperature at which this point is known is called the glass

transition temperature. Tg is an important project of heat

resistance measurement, some characterization of CCLS based.

When the insulating resin of the base material rises above Tg,

many properties change dramatically. Therefore, the higher the

Tg, the better the stability of the various properties of the

insulating material. On the other hand, materials with high Tg

generally have better dimensional stability and mechanical

strength retention than those with low Tg. In addition, the

excellent performance can be maintained in a larger temperature

range, which is very important for the manufacture of printed

circuit boards with high density, high accuracy and high

reliability.

According to the different grades of CCL $%, divided into

different heat resistance. For example, in the IPC 4101 A

standard, the general copper-clad laminates, epoxy glass cloth

laminates (including halogen based FR-4) are divided into three

grades according to different Tg characteristics. Namely:

IPC-4101/21 for Tg, FR-4 at, IPC-4101/24 for Tg, FR-4 at 150-200

DEG C, and IPC-4101/26 for Tg, and FR-4 for at 170-220 degrees.

2. classification according to whether there is halogen or not

The world's research experiments show that in the halogen

containing compounds or resins as flame retardant electrical

products (including printed circuit board substrate), in the

incineration after the waste will produce dioxin harmful

substances. Therefore, the development and use of halogen-free

PCB substrate materials is an important task in the CCL industry

and PCB industry. Since the late 1990s, there has been a "green"

substrate material - halogen-free substrate material.

According to this characteristic, the substrate material can

be divided into halogen base material and halogen-free

substrate material.

Evaluation of non halogenated substrate material is mainly

based on the Japanese printed circuit board (JPCA) industry

will be defined as compiled and published in November 1999 on

the proposed CCL standards "halogen-free" feature. Namely: the

non halogenated base material is in its resin the chlorine

content or the bromine content is less than 0.09wt%. In the

IPC-4101 standard, more specifically, the halogenated PCB base

material is divided into three different halogen-free

varieties depending on the type of flame retardant used in the

resin. Non halogen, non antimony, phosphorus containing,

halogen-free base material (inorganic filler), non halogen,

non antimony containing phosphorous containing halogen-free

base material (containing inorganic filler), non halogen non

antimony non phosphorus non halogen base plate material. And

the last one is more conducive to environmental protection

requirements.

In view of the current development of copper clad flame

retardant technology, it will be a good way to realize this kind

of high performance "green" substrate material in the future

using nano materials and new technologies.

3. classification of the coefficient of linear expansion

according to the substrate material

In PCB processing and use, in order to ensure its reliability

and stability, ensure the hole size of substrate material in

the machining process, some PCB in the design and manufacture

of low substrate material for the expansion of the more

stringent requirements (especially in a semiconductor package

substrate for material). Therefore, a new substrate material,

low thermal expansion substrate material, has been rising

rapidly in recent years. Thus, it is generally customary to have

the thermal expansion coefficient (CTE) at 12ppm/ DEG C (plate

X, Y direction) below the characteristic substrate material,

designated as low CTE substrate material.

4. paper base plate according to the punching preheating

temperature classification

The hole processing of paper based copper clad laminate is

mostly punched processing. In order to ensure the quality of

the punching process of the substrate (no cracks between the

holes, no separation between layers, the hole does not appear

around the white circle, the hole smooth and so on), it is

necessary to pre process the plate before punching. The

temperature of the preheating treatment directly affects the

size accuracy of the substrate, the flatness of the plate and

the shrinkage of the bore bore. For example, Japan Matsushita

Electric Company R-8700 paper base copper clad laminate (FR-1)

product, on the surface of the plate punching processing

temperature for punching processing under 30 DEG C, the hole

shrinkage of 0.138mm (diameter of 0.10mm); punching at 50 DEG

C, hole shrinkage of 0.150mm; punching in 70 C, hole shrinkage

of 0.165mm. In the punching process of paper base copper clad

laminate, according to the board can achieve the excellent

quality and the punching preheating temperature before

punching in (to plate surface temperature meter), production

of paper-based cover copper varieties draw two different

characteristics of punching out. Traditionally, the surface

temperature of the plate before the punching process is 30-70

DEG C for punching. The copper plate with excellent punching

quality can be called the low temperature punching plate. The

plate which is preheated and punched at more than 70 degrees

is called a high temperature punching plate. Under the

condition that the quality of punching can be reached, the lower

the preheating temperature, the better the punching

characteristics are.

5. according to the classification of the resistance to leakage

Trackings substrate material refers to the electronic products

in use, in the PCB line surface of the space position, and the

formation of carbide conductive circuit traces for a long time

by the dust accumulation, water condensation and other effects,

such trackings, in applied voltage, sparks, cause damage to the

insulation performance. Therefore, the leakage resistance of

copper clad laminate is an important safety characteristic item.

Especially for high humidity, exposure, high pressure and other

harsh conditions, PCB has more requirements in this regard.

Resistance to leakage traces, generally compared with CTI

Tracking (Commparative Index index) to express. In the IEC112

standard of CTI index is defined as: in the process of

experiment, material by 50 drops of electrolyte (water solution

of ammonium chloride 0.1% general) maximum voltage without

leakage phenomenon (generally traces value V said). IEC950 also

sets out the three CTI grades of the substrate material

according to the different voltage values that the substrate

is subjected to under the above experimental conditions. That

is, class I (CTI>=600V), level II (600V>CTI>=400V), class III

(400V>CTI>=175V). The smaller the grade of%05 of a substrate

material, the higher its resistance to leakage.

[at last, this line is red autumnal dance, Fragrant Hill at

2008-6-13, 10:54