XC7VX415T-1FF1157I

Cross-ship of Lead-free Bump

and Substrates in Lead-free

(FFG/FBG/SBG) Packages

XCN16022 (v1.0) October 31, 2016

Product Change Notice

Overview

The purpose of this notification is to announce that selected Xilinx lead-free flip chip products denoted by the

package code “FFG”, “FBG”, or “SBG” will be shipped with either the current eutectic C4 bump and associated

substrate or the new lead-free C4 bump and associated lead-free substrate. The external packaging and the

current lead-free balls will not be changed. Form, fit, function and reliability will remain the same.

Description

Xilinx offers lead free components that comply with the European Union’s RoHS 2 directive (2011/95/EU). RoHS

compliant devices are specified by adding the character “G” to the package designator portion of the part

number. Under the current RoHS directive, Xilinx flip-chip packages are exempt from the full lead-free

requirements under Exemption 15. Exemption 15 specifies that lead is allowed in solder bumps to complete a

viable electrical connection between semiconductor die and substrate within integrated circuit flip chip packages.

In 2015, the RoHS committee planned to remove Exemption 15 in July 2016. Thus, Xilinx qualified and

introduced versions of these parts with lead-free solder bump material between the semiconductor die and the

substrate. In early 2016, however, removal of RoHS Exemption 15 was delayed. We do know that the RoHS

directive will eventually eliminate Exemption 15 for newer device technologies and smaller die sizes, in 2018 at

the earliest. In order to ease the transition for Xilinx and customers well ahead of the transition date, Xilinx will

begin the gradual transition to lead-free material for the solder bumps between the semiconductor die and the

substrate. Eligible devices are in the Virtex®-5, Virtex®-6, Artix®-7, Kintex®-7, Virtex®-7 FPGAs and Zynq®-

7000 families. Defense-grade “XQ” and Automotive “XA” device-packages are not affected by this PCN.

The specific material that will change includes the C4 Bump on the wafer, the substrate, and the underfill used in

assembly. The current RoHS parts in “G” packages use bumps, substrate, and underfill appropriate for eutectic

solder (eutectic material set). The new bumps, substrate, and underfill (lead-free material set) enables the use of

fully lead-free solder bumps.

There are no differences in package reliability, form, fit or function using the lead-free material set. There are no

external package changes (BGA balls will be remain lead-free). There are no changes to the package outline

drawing. All packages meet the 8 mil (0.2 mm) package coplanarity specifications and should provide seamless

board mount results.

Until the cross ship date of July 1 2017, the products with “G” packages will only be shipped with the eutectic

material set. After the cross ship date, the products with “G” packages will be shipped with either eutectic or lead-

free material sets. When the RoHS Directive changes to remove Exemption 15, all product should be shifted to

the lead-free material set already. Note that all affected product shipped will meet the RoHS Directive.

质量等级领域:宇航级IC、特军级IC、超军级IC、普军级IC、禁运IC、工业级IC，军级二三极管，功率管

等;

应用领域:航空航天、船舶、汽车电子、军用计算机、铁路、医疗电子、通信网络、电力工业以及大型工

业设备

祝您:工作顺利，生活愉快!

以赛灵思半导体（深圳）有限公司提供的参数为例，以下为XC7VX415T-1FF1157I的详细参数，仅供参考

XCN16022 (v1.0) October 31, 2016

Device

XC5VFX30T

XC5VFX70T

XC5VFX70T

XC5VFX100T

XC5VFX100T

XC5VLX20T

XC5VLX30

XC5VLX30

XC5VLX30T

XC5VLX30T

XC5VLX50

XC5VLX50

XC5VLX50

XC5VLX50T

XC5VLX50T

XC5VLX85

XC5VLX85

XC5VLX85T

Package

FFG665

FFG1136

FFG665

FFG1136

FFG1738

FFG323

FFG324

FFG676

FFG323

FFG665

FFG1153

FFG324

FFG676

FFG1136

FFG665

FFG1153

FFG676

FFG1136

Device

XC5VSX35T

XC5VSX50T

XC5VSX50T

XC5VSX95T

XC5VLX110

XC5VLX110

XC5VLX110

XC5VLX110T

XC5VLX110T

XC5VLX155

XC5VLX155

XC5VLX155T

XC5VLX155T

XCE05L11

XCE05L11T

XCE05L15

XCE05S05T

Package

FFG665

FFG1136

FFG665

FFG1136

FFG1153

FFG1760

FFG676

FFG1136

FFG1738

FFG1153

FFG1760

FFG1136

FFG1738

FFG1153

FFG1136

FFG1153

FFG1136

Cross-ship of Lead-free Bump & Substrates in Lead-free (FFG/FBG/SBG) Packages

Table 3: 7 Series and Zynq-7000 Products Affected

Key Dates and Ordering Information

will begin cross-shipping the new material set for bumps, substrate, and underfill on July 1, 2017.

Traceability

To enable traceability, any products with “G” packages shipped that use the new lead-free material set will be

marked with a special Pb-Free character in the upper right corner of the part as shown in Figure 1

below. There

will be no mark for the eutectic material set. Marking changes are reflected in the product documents UG475,

UG865, UG365 and UG195, available .

XCN16022 (v1.0) October 31, 2016

Cross-ship of Lead-free Bump & Substrates in Lead-free (FFG/FBG/SBG) Packages

XILINX

®

KINTEX-7

XC7K325T™

FFG676ABC1519

CF1234567A

2E

Taiwan

KKN2W1.00 CF1234567A 1519

Indicates Full Lead Free Compliant

(RoHS 6/6) Material Set

Figure 1: Package Topmark

Note: Refer to XCN16014

for 2D barcode additional marking.

Qualification Data

Qualification data will be available and provided upon request.

Response

No response is required. For additional information or questions, please contact .

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Revision History

The following table shows the revision history for this document.

Date Version Revision

10/31/16 1.0 Initial release.

Cross-ship of Lead-free Bump & Substrates in Lead-free (FFG/FBG/SBG) Packages

XCN16022 (v1.0) October 31, 2016