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2024年12月28日发(作者：js删除数组元素并减少长度)

专利内容由知识产权出版社提供

专利名称：SUBSTRATE USED FOR LED

ENCAPSULATION, THREE-DIMENSIONAL

LED ENCAPSULATION, BULB COMPRISING

THREE-DIMENSIONAL LED ENCAPSULATION

AND MANUFACTURING METHOD

THEREFOR

发明人：Andrew YEUNG

申请号：US15518983

申请日：20151015

公开号：US2A1

公开日：20170824

专利附图：

摘要：Provided are a substrate used for an LED encapsulation, a three-dimensional

LED encapsulation comprising the substrate, a bulb comprising the three-dimensional

LED encapsulation and a manufacturing method therefor. The substrate is spiral lines in

shape, at least one of the ends of the substrate is provided with an electrode lead wire,

the electrode lead wire is connected with the substrate by a connective component

and/or connective materials, the spiral lines of the substrate comprise gaps between

each other, and a smooth curve and/or a plurality of polylines end to end is formed at

least partly at the edge of the substrate. The three-dimensional LED encapsulation and

the bulb comprising the three-dimensional LED encapsulation comprise the substrate,

multiple LED chips in series and/or parallel are arranged on the substrate, the multiple

LED chips are let out by the electrode lead wire of one end of the substrate and the

other end of the substrate as the other electrode lead wire. All-dimensional and three-

dimensional and multilayer light-emitting of the bulb may be realized, moreover, the

heat is easy to dissipate, the structure is simple to manufacture, and the cost is low.

申请人：SIM Lighting Design Company Limited

地址：Hong Kong CN

国籍：CN

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