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2024年12月28日发(作者：sqlplus命令执行sql文件)

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专利名称：SUBSTRATE DETECTING APPARATUS,

SUBSTRATE ALIGNING APPARATUS,

SUBSTRATE BONDING APPARATUS HAVING

SUBSTRATE DETECTING APPARATUS AND

SUBSTRATE ALIGNING APPARATUS, WAFER

OUTER SHAPE DETECTING APPARATUS,

WAFER ALIGNING APPARATUS, AND WAFER

BONDING APPARATUS HAVING WAFER

OUTER SHAPE DETECTING APPARATUS AND

WAFER OUTER SHAPE DETEC

发明人：TANAKA, Toshihisa,OONE, Kazuyasu

申请号：JP2008060724

申请日：20080605

公开号：WO08/153086P1

公开日：20081218

摘要：A wafer outer shape detecting apparatus (10) is provided with a rotating

apparatus (12) for rotating a wafer (11); an edge detecting apparatus (15) for detecting

the edge of the wafer placed on the rotating apparatus; a servo apparatus (16) for

making the edge detecting apparatus follow displacement of the wafer edge; and a

position detecting apparatus (17) for detecting the position of the edge detecting

apparatus to the radius direction of the wafer.

申请人：TANAKA, Toshihisa,OONE, Kazuyasu

地址：2-3, Marunouchi 3-chome, Chiyoda-ku, Tokyo 1008331 JP,C/O NIKON

CORPORATION, 2-3, Marunouchi 3-chome, Chiyoda-ku, Tokyo 1008331 JP,C/O NIKON

CORPORATION, 2-3, Marunouchi 3-chome, Chiyoda-ku, Tokyo 1008331 JP

国籍：JP,JP,JP

代理机构：INOUE, Yoshio

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