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2024年12月28日发(作者：玳瑁标本的市场价三十万)
专利内容由知识产权出版社提供
专利名称：Placement method of an electronic module
on a substrate and device produced by said
method
发明人：Francois Droz
申请号：US11342911
申请日：20060130
公开号：US2A1
公开日：20060803
专利附图：
摘要：The aim the disclosed process is to ensure maximum precision both at the level
of the manufacturing of an electronic assembly from a chip with small dimensions as well
as the level of the placement of such an assembly on an insulating substrate. This aim is
achieved by a placement process on a support, called substrate, of at least one
electronic assembly consisting of a chip including at least one electric contact on one of
its faces, said contact being connected to a segment of conductive track, and said
placement being carried out by means of a placement device holding and positioning said
assembly on the substrate, comprising the following steps: formation of a segment of
conductive track having a predetermined outline, transfer of the track segment onto the
placement device, seizing of the chip with the placement device carrying the track
segment in such a way that said track segment is placed on at least one contact of the
chip. placement of the electronic assembly consisting of the chip and the track segment
at a predetermined position on the substrate, embedding of the chip and of the track
segment into the substrate. A placement device used in the process and a portable
object including an electronic assembly placed according to the process are also objects
of the present invention.
申请人：Francois Droz
地址：Corcelles CH
国籍：CH
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