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DMN6075S-7

I

D

Max

T

A

= +25°C

2.5A

2.0A

DMN6075S

Features and Benefits

N MOSFET

Low On-Resistance

Low Input Capacitance

Fast Switching Speed

Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)

Halogen and Antimony Free. “Green” Device (Note 3)

Qualified to AEC-Q101 Standards for High Reliability

60V N-CHANNEL ENHANCEMENT MODE MOSFET

Summary

BV

DSS

60V

R

DS(ON)

Max

85mΩ @ V

GS

= 10V

120mΩ @ V

GS

= 4.5V

Description

This new generation MOSFET is designed to minimize the on-state

resistance (R

DS(ON)

) and yet maintain superior switching performance,

making it ideal for high efficiency power management applications.

Mechanical Data

Case: SOT23

Case Material: Molded Plastic, “Green” Molding Compound;

UL Flammability Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020

Terminal Connections: See Diagram Below

Terminals: Finish - Matte Tin Annealed over Copper Leadframe.

Solderable per MIL-STD-202, Method 208

e3

Weight: 0.008 grams (Approximate)

Applications

SOT23

DC-DC Converters

Power Management Functions

Backlighting

D

D

G

G

S

S

Top View

Top View

Top View

Pin Configuration

Ordering Information

(Note 4)

Product

DMN6075S-7

DMN6075S-13

Notes:

Reel Size (inches)

7

13

Tape Width (mm)

8

8

Quantity per Reel

3,000

10,000

1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.

2. See /quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"

and Lead-free.

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and

<1000ppm antimony compounds.

4. For packaging details, go to our website at /design/support/packaging/diodes-packaging/.

Marking Information

Date Code Key

Year 2014

Code

B

SOT23

S67 = Product Type Marking Code

YM = Date Code Marking

Y or = Year (ex: F = 2018)

M = Month (ex: 9 = September)

S67

~

~

Jan

1

Feb

2

2017

E

Mar

3

Y

M

2018

F

Apr

4

2019

G

May

5

2020

H

Jun

6

2021

I

Jul

7

2022

J

Aug

8

Sep

9

2023

K

Oct

O

2024

L

Nov

N

2025

M

Dec

D

May 2018

Month

Code

DMN6075S

Document number: DS37023 Rev. 6 - 2

1 of 7

© Diodes Incorporated

DMN6075S

Maximum Ratings

(@T

A

= +25°C, unless otherwise specified.)

Characteristic

Drain-Source Voltage

Gate-Source Voltage

Steady

State

Steady

State

T

A

= +25°C

T

A

= +70°C

T

A

= +25°C

T

A

= +70°C

Symbol

V

DSS

V

GSS

I

D

I

D

I

S

I

DM

Value

60

±20

2.0

1.5

2.5

2.0

2.0

12

Unit

V

V

A

A

A

A

Continuous Drain Current (Note 5) V

GS

= 10V

Continuous Drain Current (Note 6) V

GS

= 10V

Maximum Body Diode Forward Current (Note 5)

Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)

Thermal Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic

Total Power Dissipation (Note 5)

Thermal Resistance, Junction to Ambient (Note 5)

Total Power Dissipation (Note 6)

Thermal Resistance, Junction to Ambient (Note 6)

Operating and Storage Temperature Range

T

A

= +25°C

T

A

= +70°C

Steady State

T

A

= +25°C

T

A

= +70°C

Steady State

Symbol

P

D

R

JA

P

D

R

JA

T

J,

T

STG

Value

0.8

0.5

157

1.15

0.7

110

-55 to +150

Unit

W

°C/W

W

°C/W

°C

Electrical Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic

OFF CHARACTERISTICS (Note 7)

Drain-Source Breakdown Voltage

Zero Gate Voltage Drain Current T

J

= +25°C

Gate-Source Leakage

ON CHARACTERISTICS (Note 7)

Gate Threshold Voltage

Static Drain-Source On-Resistance

Diode Forward Voltage

DYNAMIC CHARACTERISTICS (Note 8)

Input Capacitance

Output Capacitance

Reverse Transfer Capacitance

Gate Resistance

Total Gate Charge (V

GS

= 10V)

Total Gate Charge (V

GS

= 4.5V)

Gate-Source Charge

Gate-Drain Charge

Turn-On Delay Time

Turn-On Rise Time

Turn-Off Delay Time

Turn-Off Fall Time

Notes:

Symbol

BV

DSS

I

DSS

I

GSS

V

GS(TH)

R

DS(ON)

V

SD

C

iss

C

oss

C

rss

R

g

Q

g

Q

g

Q

gs

Q

gd

t

D(ON)

t

R

t

D(OFF)

t

F

Min

60

1

Typ

69

75

606

32.6

24.6

1.5

12.3

5.6

1.7

1.9

3.5

4.1

35

11

Max

1.0

±100

3

85

120

1.2

Unit

V

µA

nA

V

V

pF

pF

pF

Ω

nC

nC

nC

nC

ns

ns

ns

ns

Test Condition

V

GS

= 0V, I

D

= 250μA

V

DS

= 60V, V

GS

= 0V

V

GS

= ±16V, V

DS

= 0V

V

DS

= V

GS

, I

D

= 250μA

V

GS

= 10V, I

D

= 3.2A

V

GS

= 4.5V, I

D

= 2.8A

V

GS

= 0V, I

S

= 2.5A

V

DS

= 20V, V

GS

= 0V,

f = 1.0MHz

V

DS

= 0V, V

GS

= 0V, f = 1MHz

V

DS

= 30V, I

D

= 3A

V

GS

= 10V, V

DS

= 30V,

R

g

= 20Ω, R

L

= 50Ω

5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.

6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal vias to bottom layer 1-inch square copper plate.

7. Short duration pulse test used to minimize self-heating effect.

8. Guaranteed by design. Not subject to product testing.

DMN6075S

Document number: DS37023 Rev. 6 - 2

2 of 7

May 2018

© Diodes Incorporated

15.0

V

GS

= 10V

V

GS

= 4.0V

DMN6075S

10

V = 5.0V

DS

12.0

I

D

,

D

R

A

I

N

C

U

R

R

E

N

T

(

A

)

9.0

I

D

,

D

R

A

I

N

C

U

R

R

E

N

T

(

A

)

V

GS

=5.0V

V

GS

= 3.5V

6.0

V

GS

= 3.0V

3.0

V

GS

= 2.5V

)

A

(

T

N

E

6

R

R

U

C

N

I

4

A

R

D

,

D

I

2

8

T = 150°C

A

T = 125°C

A

T = 85°C

A

T = 25°C

A

T = -55°C

A

0.0

0234

V

DS

, DRAIN-SOURCE VOLTAGE (V)

Figure 1 Typical Output Characteristics

15

R

D

S

(

O

N

)

,

D

R

A

I

N

-

S

O

U

R

C

E

O

N

-

R

E

S

I

S

T

A

N

C

E

(

)

R

D

S

(

O

N

)

,

D

R

A

I

N

-

S

O

U

R

C

E

O

N

-

R

E

S

I

S

T

A

N

C

E

(

)

0.15

0

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

V , GATE-SOURCE VOLTAGE (V)

GS

Figure 2 Typical Transfer Characteristics

0.2

I

D

= 3.2A

0.18

0.16

0.14

0.12

0.1

0.08

0.06

0.04

I

D

= 2.8A

0.12

0.09

V

GS

= 4.5V

0.06

V

GS

= 10V

0.03

0

036912

I

D

, DRAIN-SOURCE CURRENT (A)

Figure 3 Typical On-Resistance vs.

Drain Current and Gate Voltage

15

24681012141618

V

GS

, GATE-SOURCE VOLTAGE (V)

Figure 4 Typical Transfer Characteristics

20

2.4

R

D

S

(

O

N

)

,

D

R

A

I

N

-

S

O

U

R

C

E

O

N

-

R

E

S

I

S

T

A

N

C

E

(

)

0.2

)

(

E

C

N

A

T

S

0.15

I

S

E

R

-

N

O

E

0.1

C

R

U

O

S

-

N

I

A

R

0.05

D

,

)

N

V = 10V

GS

T = 150°C

A

T = 125°C

A

R

D

S

(

O

N

)

,

D

R

A

I

N

-

S

O

U

R

C

E

O

N

-

R

E

S

I

S

T

A

N

C

E

(

N

O

R

M

A

L

I

Z

E

D

)

2

T = 85°C

A

V

GS

= 10V

I

D

= 5A

1.6

V

GS

= 4.5V

I

D

= 3A

T = 25°C

A

T = -55°C

A

1.2

0.8

R

O

(

S

D

0

I , DRAIN CURRENT (A)

D

Figure 5 Typical On-Resistance vs.

Drain Current and Temperature

0.4

-50-255150

T

J

, JUNCTION TEMPERATURE (C)

Figure 6 On-Resistance Variation with Temperature

3 of 7

May 2018

© Diodes Incorporated

DMN6075S

Document number: DS37023 Rev. 6 - 2

R

D

S

(

O

N

)

,

D

R

A

I

N

-

S

O

U

R

C

E

O

N

-

R

E

S

I

S

T

A

N

C

E

(

)

DMN6075S

0.2

0.18

0.16

0.14

0.12

0.1

0.08

0.06

0.04

0.02

0

-50-255150

T

J

, JUNCTION TEMPERATURE (C)

Figure 7 On-Resistance Variation with Temperature

V

GS

= 10V

I

D

= 5A

V

GS

= 4.5V

I

D

= 3A

2.5

V

G

S

(

T

H

)

,

G

A

T

E

T

H

R

E

S

H

O

L

D

V

O

L

T

A

G

E

(

V

)

)

V

(

E

G

A

T

2

L

O

V

D

L

O

H

S

1.5

E

R

H

T

E

T

A

G

1

,

)

h

I = 1mA

D

I = 250µA

D

V

t

(

S

G

0.5

-50

-25

0

25

50

75

100

125

150

T , JUNCTION TEMPERATURE (°C )

J

Figure 8 Gate Threshold Variation vs. Junction Temperature

10

10000

f = 1MHz

)

A

(

T

N

E

R

R

U

C

E

C

R

U

O

S

,

S

I

I

S

,

S

O

U

R

C

E

C

U

R

R

E

N

T

(

A

)

8

C

T

,

J

U

N

C

T

I

O

N

C

A

P

A

C

I

T

A

N

C

E

(

p

F

)

1000

C

iss

6

T = 150°C

A

T =125°C

A

T = 25°C

A

4

100

C

oss

C

rss

2

T =85°C

A

T = -55°C

A

10

0

0

V , SOURCE-DRAIN VOLTAGE (V)

SD

Figure 9 Diode Forward Voltage vs. Current

0.3

0.6

0.9

1.2

1.5

1

0102030

V

DS

, DRAIN-SOURCE VOLTAGE (V)

Figure 10 Typical Junction Capacitance

R

DS(ON)

Limited

40

10

100

V

V

G

T

E

T

R

E

S

H

O

L

D

V

L

O

L

T

G

A

G

(

)

V

(

V

E

E

E

S

C

A

E

H

R

T

T

U

A

O

O

G

,

A

V

)

S

G

G

S

9

8

7

6

5

4

3

2

1

0

024681012

Q

g

, TOTAL GATE CHARGE (nC)

Figure 11 Gate Charge

14

V

DS

= 30V

I

D

= 3A

10

)

A

(

T

N

1

E

R

R

U

C

N

0.1

I

A

R

D

,

D

I

0.01

I

D

,

D

R

A

I

N

C

U

R

R

E

N

T

(

A

)

P = 10s

W

P = 1s

W

P = 100ms

W

P = 10ms

W

P = 1ms

W

T = 150°C

J(MAX)

P = 100µs

W

T = 25°C

A

V = 10V

GS

Single Pulse

DUT on 1 * MRP Board

0.001

0.1

1

10

V , DRAIN-SOURCE VOLTAGE (V)

DS

Figure 12 SOA, Safe Operation Area

DC

100

DMN6075S

Document number: DS37023 Rev. 6 - 2

4 of 7

May 2018

© Diodes Incorporated

E

C

N

A

T

S

I

S

E

R

L

A

M

R

E

H

T

T

N

E

I

S

N

A

R

T

,

)

t

(

r

DMN6075S

r

(

t

)

,

T

R

A

N

S

I

E

N

T

T

H

E

R

M

A

L

R

E

S

I

S

T

A

N

C

E

1

D = 0.9

D = 0.7

D = 0.5

D = 0.3

0.1

D = 0.1

D = 0.05

0.0001

D = 0.02

0.01

D = 0.01

D = 0.005

Single Pulse

0.001

0.00001

R

JA

(t) = r(t) * R

JA

= 152°C/W

R

JA

Duty Cycle, D = t1/ t2

0.001

0.01

0.1

1

t1, PULSE DURATION TIME (sec)

Figure 13 Transient Thermal Resistance

10

1000100

DMN6075S

Document number: DS37023 Rev. 6 - 2

5 of 7

May 2018

© Diodes Incorporated

Package Outline Dimensions

Please see / for the latest version.

All 7°

H

DMN6075S

SOT23

SOT23

Dim Min Max Typ

A

0.37 0.51 0.40

B

1.20 1.40 1.30

C

2.30 2.50 2.40

D

0.89 1.03 0.915

F

0.45 0.60 0.535

G

1.78 2.05 1.83

H

2.80 3.00 2.90

J

0.013 0.10 0.05

K

0.890 1.00 0.975

K1

0.903 1.10 1.025

L

0.45 0.61 0.55

L1

0.25 0.55 0.40

M

0.085 0.150 0.110

a

0° 8° --

All Dimensions in mm

GAUGE PLANE

0.25

K1

K

J

a

A

M

LL1

C

B

D

F

G

Suggested Pad Layout

Please see / for the latest version.

SOT23

Y

Y1

C

Dimensions Value (in mm)

C

2.0

X

0.8

X1

1.35

Y

0.9

Y1

2.9

X

X1

DMN6075S

Document number: DS37023 Rev. 6 - 2

6 of 7

May 2018

© Diodes Incorporated

IMPORTANT NOTICE

DMN6075S

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,

INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE

(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes

without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the

application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or

trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume

all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated

website, harmless against all damages.

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.

Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and

hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or

indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings

noted herein may also be covered by one or more United States, international or foreign trademarks.

This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the

final and determinative format released by Diodes Incorporated.

LIFE SUPPORT

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express

written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the

labeling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the

failure of the life support device or to affect its safety or effectiveness.

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and

acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any

use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related

information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its

representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.

Copyright © 2018, Diodes Incorporated

DMN6075S

Document number: DS37023 Rev. 6 - 2

7 of 7

May 2018

© Diodes Incorporated

DMN6075S-7


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