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2024年12月27日发(作者：react父子组件通信ref)
smt工艺图流程英文介绍
The process flow of Surface Mount Technology (SMT)
mainly includes the following steps:
1. Substrate preparation: Firstly, select the appropriate
substrate material, commonly used are FR4, metal substrates,
etc. Then, perform necessary cleaning and surface treatment
on the substrate to ensure welding quality.
2. Attachment of surface-mounted components:
Accurately attach surface-mounted components (such as
resistors, capacitors, chips, etc.) that have been prepared in
the component inventory to the substrate according to the
process requirements. This step is usually completed by an
automatic placement machine.
3. Curing and bonding: Fix the surface-mounted
components already attached to the substrate through reflow
soldering or wave soldering, ensuring a secure connection.
4. Soldering of through-hole components: For
components that require through-hole assembly (such as
sockets, connectors, etc.), insert them into the corresponding
positions on the substrate for connection with other
components.
5. Soldering of leaded components: For components that
need to be soldered for connection (such as IC chips, diodes,
etc.), use appropriate soldering methods (such as wave
soldering, manual soldering, etc.) to solder them to the
substrate.
6. Cleaning and inspection: Clean and inspect the
assembled substrate to ensure that there are no residual
solder flux or other contaminants, and make necessary
corrections if needed.
7. Testing and debugging: Perform functional testing and
debugging on the assembled circuit board to verify its
performance, reliability, and stability.
8. Packaging and delivery: The final step is to package the
finished substrate and label, categorize, and deliver it
according to customer requirements.
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