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2024年12月27日发(作者：负载均衡服务器配置)
fcbga封装基板制作流程
English answer:
FCBGA Substrate Fabrication Process.
The FCBGA (Flip Chip Ball Grid Array) substrate
fabrication process involves the following steps:
1. Substrate Preparation: The substrate is made of a
dielectric material, such as FR-4 or polyimide. It is first
cleaned and prepared to ensure a good adhesion between the
substrate and the copper layers.
2. Copper Patterning: A layer of copper is deposited on
the substrate using a process called electroplating. The
copper layer is patterned to create the circuit traces and
pads for the FCBGA package.
3. Solder Mask Application: A solder mask is applied to
the substrate to protect the copper traces and pads from
oxidation and solder bridging. The solder mask is typically
made of a polymer material.
4. Surface Finish: A surface finish is applied to the
copper traces and pads to improve solderability. The
surface finish can be either a solderable finish, such as
tin-lead or gold, or a non-solderable finish, such as
nickel or palladium.
5. Ball Grid Array (BGA) Formation: Solder balls are
placed on the pads of the FCBGA substrate using a process
called ball attach. The solder balls are typically made of
a tin-lead or tin-silver-copper alloy.
6. Flip Chip Assembly: The flip chip is placed on the
solder balls of the FCBGA substrate using a process called
flip chip bonding. The flip chip is typically a
semiconductor die that contains the integrated circuit (IC)
for the package.
7. Underfill Dispensing: An underfill material is
dispensed between the flip chip and the FCBGA substrate to
provide mechanical support and improve thermal conductivity.
The underfill material is typically a polymer material.
8. Curing: The underfill material is cured to solidify
and form a strong bond between the flip chip and the FCBGA
substrate.
9. Final Inspection: The FCBGA package is inspected to
ensure that it meets all of the required specifications.
Chinese answer:
FCBGA封基板制造流程。
FCBGA（倒装芯片球栅阵列）封基板制造流程包括以下步骤：
1. 基板准备，基板由介电材料制成，如 FR-4 或聚酰亚胺。首
先对其进行清洁和准备，以确保基板与铜层之间的良好粘合。
2. 铜图案化，使用电镀工艺在基板上沉积一层铜。对铜层进行
图案化，以创建 FCBGA 封装的电路走线和焊盘。
3. 阻焊层应用，在基板上应用阻焊层，以保护铜走线和焊盘免
受氧化和焊料搭接。阻焊层通常由聚合物材料制成。
4. 表面处理，对铜走线和焊盘进行表面处理，以提高可焊性。
表面处理可以是可焊性表面处理，如锡铅或金，也可以是不可焊性
表面处理，如镍或钯。
5. 球栅阵列 (BGA) 形成，使用称为焊球附着的工艺，在
FCBGA 基板的焊盘上放置焊球。焊球通常由锡铅或锡银铜合金制成。
6. 倒装芯片组装，使用称为倒装芯片键合的工艺，将倒装芯片
放置在 FCBGA 基板的焊球上。倒装芯片通常是包含封装集成电路
(IC) 的半导体芯片。
7. 底部填充剂分配，在倒装芯片和 FCBGA 基板之间分配底部
填充剂，以提供机械支撑并提高导热性。底部填充剂通常是聚合物
材料。
8. 固化，固化底部填充剂，使其固化并形成倒装芯片和 FCBGA
基板之间的牢固粘合。
9. 最终检查，检查 FCBGA 封装，以确保其符合所有必需的规
格。
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